Measures the ability of the connection to remain intact under mechanical load.
In modern electronics, solderless connections are everywhere. Their reliability is paramount. A single loose crimp or weak press-fit connection can lead to intermittent device failures, data corruption, or even a safety hazard. Following IEC 60352 standards ensures that these connections are reliable, repeatable, and can withstand the intended operating conditions. iec 603525 pdf
The International Electrotechnical Commission (IEC) has published a standard for solderless connections, specifically for surface mounting of components. IEC 60352-5 provides guidelines for the design, testing, and implementation of solderless connections for surface-mounted components. Measures the ability of the connection to remain
The current version is the , officially published on November 22, 2024 . This is a consolidated version (designated as CSV ), which includes the original 2009 standard and the recent 2024 Amendment 1, effectively creating a single, up-to-date document. A single loose crimp or weak press-fit connection
Engineers utilize the PDF document primarily to reference specific performance metrics during the design qualification phase. Mechanical Performance Metrics
Focused on clarifying materials and adding testing recommendations.